News|Impact Assessment: Wafer-scale CMOS Technology for Room-temperature GeSn Photodetectors

Impact Assessment: Wafer-scale CMOS Technology for Room-temperature GeSn Photodetectors

Dresden/ Germany09/01/2025

News

HZDR has successfully scaled its CMOS-compatible GeSn photodetector technology to the 3-inch wafer level. Using advanced methods such as ion implantation and flash lamp annealing, the technology progressed from TRL 3 (lab proof-of-concept) to TRL 4 (prototype validation).

Wafer-scale CMOS Technology for Room-temperature GeSn Photodetectors
Wafer-scale CMOS Technology for Room-temperature GeSn Photodetectors

The Hi-Acts Use Case Initiative (UCI) is a targeted funding programme that bridges cutting-edge accelerator-based research with industrial innovation. Its core goal is to generate measurable technological, economic, and societal impact by accelerating the translation of accelerator technologies into practical applications.

Helmholtz-Zentrum Dresden Rossendorf (HZDR) scaled its CMOS-compatible GeSn photodetector technology from lab-scale single devices (10×10 mm) to industry-standard 3-inch wafers. Using ion implantation and flash lamp annealing, the project demonstrated the feasibility of wafer-scale GeSn photodetectors, advancing the technology from TRL 3 to TRL 4. TRL, or Technology Readiness Level, is a standard measure of how mature a technology is — with level 3 representing proof-of-concept in the lab, and level 4 indicating validation at the prototype stage.

GeSn detectors can be manufactured using existing CMOS infrastructure, which is the standard technology platform for producing semiconductor chips. This compatibility allows low-cost and scalable production. HZDR estimates a cost reduction from €500 to around €10 per sensor – a potential 99.8% saving – opening applications in healthcare, agriculture, and LiDAR systems.

The detectors also eliminate the need for cooling, delivering 40–50% energy savings compared to current alternatives, while supporting EU sustainability goals by using non-toxic, recyclable materials. These characteristics align with the European Chips Act, reinforcing Europe’s resilience in the semiconductor supply chain.

The project has already sparked follow-on commercial opportunities, including plans for a spin-out company and market studies with local Dresden research service firms. Engagement with potential end-users revealed strong demand in automotive LiDAR and precision agriculture.

By scaling a pioneering technology to industry-standard wafers, the project strengthens Dresden’s semiconductor ecosystem, positions HZDR as a leader in CMOS photonics, and lays the groundwork for commercialisation in a rapidly growing €147m SWIR market. SWIR, or short-wave infrared, refers to a spectral range of light (1–3 micrometres) widely used in sensing applications such as imaging, spectroscopy, and LiDAR. This UCI-funded advance highlights how accelerator-based research can drive industrial efficiency, environmental sustainability, and European technological sovereignty.

You can find the report and infographic to download below:

·       Case-specific report (PDF)

·       Case-specific infographic (PDF)

·       Link to the corresponding Hi-Acts website page under “Success Stories”