Manual and semi-automatic ion implantation into wafers by spin-off

Spin-off for closer cooperation with semiconductor industry

However, not every company has the necessary and very expensive accelerator technology. The HZDR, on the other hand, operates Europe’s largest and most state-of-the-art ion beam centre, in the shape of the IBC. And it offers industrial companies the opportunity to utilise beamtime there to improve their materials through ion implantation. HZDR Innovation GmbH (HZDRi) was founded specifically for this purpose: it advises interested industrial partners individually, designs joint projects for the research and development of new or improved materials, and provides access to the relevant specialists and high-tech equipment. Small batch production is also possible thanks to shift operation. The IBC’s facilities operate in a wide energy range and, in addition to the typical standard energies, they also cover high-energy ion implantation. The ion sources include a large selection of available ion species, encompassing most of the periodic table.

In many cases, the aim is to produce new types of microchips for semiconductor technologies. Depending on the geometry and properties of the wafers, manual or semi-automatic wafer handling is available at the IBC. Manual handling is particularly suitable for thin and fragile wafers. The cassette-based system allows small samples and components all the way up to 200-mm wafers to be processed. Standard wafers with a high throughput are handled by a robot.

Hence, the co-operation between HZDR and HZDRi makes it easier for other industrial companies in the microelectronics sector to access unique technologies, in order to improve their materials and thus keep pace with the ever-increasing demands made of modern electronics. Society is benefiting from more powerful computers and electrical devices, which are also becoming more energy-efficient as a result.

Partners involved

• HZDR
• HZDR Innovation GmbH
• Various industrial partners